TI is building the industry’s most comprehensive portfolio of Arm Cortex-M0+ based MCUs – expanding an already extensive semiconductor offering with options for general-p

As electrical systems become increasingly dense and interconnected, mitigating EMI is a critical system design consideration for engineers.

The TPS62912 and TPS62913 offer low noise of 20 µVRMS for frequencies ranging from 100 Hz to 100 kHz and ultra-low output-voltage ripple of 10 µVRMS, giving engineers t

Texas Instruments (TI) today expanded its high-voltage power management portfolio with the next generation of 650-V and 600-V gallium nitride (GaN) field-effect transisto

Industry first DC/DC controllers with an integrated active EMI filter enable engineers to achieve the smallest low-EMI power designs

New TI humidity sensors provide the highest reliability and built-in resistance to contaminants and harsh environments

TI to acquire Micron 300-mm semiconductor factory, extending TI cost advantage and greater control of supply chain

New MCU portfolio redefines microcontroller performance, enabling 10 times higher processing capability than existing devices

The BQ25790 and BQ25792 offer the flexibility to charge batteries with one to four cells in a series and up to 5 A of charging current across the full input-voltage range

Fully integrated power solutions such as the UCC14240-Q1 help engineers take advantage of distributed architecture.

The TMAG5170 is the first device in a new family of 3D Hall-effect position sensors that will meet a wide range of industrial needs – from ultra-high performance to gener

Designers can leverage this faster throughput to measure higher-frequency signals more accurately in test and measurement applications including oscilloscopes, active pro

The new isolated solid-state relays also provide the smallest solution size while reducing the bill-of-materials (BOM) cost of powertrain and 800-V battery-management sys

Pricing for the CC2340 family will start as low as $0.79, making it affordable for engineers to add Bluetooth LE connectivity to more products.

Compared to traditional ceramic packages, plastic packages offer a smaller footprint that enables designers to reduce system-level size, weight and power, and thus help r